Reliability Information Analysis Center Forums > RIAC WARP Forum > Comments on a Specific Model

1. Life-Stress Relationship for Thin Film Transistor Gate Line Interconnects On Flexible Substrates
2. A New TDDB Degradation Model Based On Cu Ion Drift in Cu Interconnect Dielectrics
3. Spall Progression Life Model for Rolling Contact Verified by Finish Hard Machined Surfaces
4. Novel Model for HCI Degradation and Impact of Conventional and Non-Conventional Scaling
5. Analytical Approach for Wear Prediction of Metallic Materials in Tribological Applications
6. A Chemical Mechanical Polishing Model Based on the Viscous Flow of the Amorphous Layer
7. Wear Rate Model for UHMWPE in Total Joint Applications
8. Prediction of Logic Product Failure Due to Thin-Gate Oxide Breakdown
9. Analytical Approach for Wear Prediction of Non-Oxide Ceramic Materials in Tribological Applications
10. On-State Drain Bias TDDB Lifetime Model and HCI Effect on Drain Bias TDDB of Ultra Thin Oxide
11. Modeling of the Temperature Dependence of Soft Breakdown Conduction in Ultrathin Gate Oxides
12. The Relationship Between Wear and Dissipated Energy in Sliding Systems
13. A Physical Model of Time-Dependent Dielectric Breakdown in Copper Metallization
14. Physical Model for the Prediction of Pavement Polishing
15. Developing a Mathematical Model to Evaluate Wear Rate of AA7075/SiCp Powder Metallurgy Composites
16. Physical Modeling of Negative Bias Temperature Instabilities for Predictive Extrapolation
17. Device Degradation Model for Stacked-ONO Gate Structure with Using SONOS and MOS Transistors
18. Failure Mechanism Models for Electromigration
19. Rolling/Sliding Contact Fatigue Life Prediction of Sintered and Hardened Steels-Fracture Mechanics M
20. Rolling/Sliding Contact Fatigue Life Prediction of Sintered and Hardened Steels-Tallian Model
21. Correlation Between Surface Fatigue and Microstructural Defects of Cemented Carbides
22. Silicon Nitride MIM Capacitor Reliability for Multiple Dielectric Thickness
23. Accelerated lifetime measurements on thin film ferroelectric materials with high dielectric constant
24. A New Model for the Field Dependence of Intrinsic and Extrinsic Time-Dependent Dielectric Breakdown
25. CAF in Composite Printed-Circuit Substrates: Characterization, Modeling, and a Resistant Material
26. A Voltage Acceleration Lifetime Model to Predict Post-Cycling LTDR Characteristics
27. Gear Tooth Wear in Sintered Spur Gears Under Dry Running Conditions
28. Accelerated Life Testing and Reliability of High K Multilayer Ceramic Capacitors
29. Nozzle Passage Aerodynamic Design to Reduce Solid Particle Erosion of a Supercritical Steam Turbine
30. Modelling Negative Bias Temperature Instabilities in Advanced p-MOSFETs
31. Mathematical Model of Abrasive Wear of High Performance Concrete (HPC)
32. An Erosion-Based Model for Abrasive Waterjet Turning of Ductile Materials
33. A Random Wear Model for the Interaction Between a Rough and a Smooth Surface
34. Logistic Curve Model of Cavitation Erosion Progress in Metallic Materials
35. Creep Oxidation Behaviour and Creep Strength Prediction for Alloy 617
36. Modeling of NBTI Degradation and its Impact on Electric Field Dependence of the Lifetime
37. Mechanism and Modeling of PMOS NBTI Degradation with Drain Bias
38. A New Waveform-Dependent Lifetime Model for Dynamic NBTI in PMOS Transistor
39. Modeling and Simulation of Hot-carrier-induced Device Degradation in MOS Circuits
40. Practical Estimation of Erosion Damage Caused by Solid Particle Impact
41. A Procedure for the Wear Prediction of Collector Strip and Contact Wire in Pantograph-Catenary Syste
42. Rolling Contact Fatigue Life of Finish Hard Machined Surfaces
43. Tool Crater Wear Depth Modeling in CBN Hard Turning
44. A Total Fatigue Life Model for Mode I Delaminated Composite Laminates
45. Drain Biased TDDB Lifetime Model for Ultra Thin Gate Oxide
46. Modeling Sliding Wear: From Dry to Wet Environments - Gaseous Environment
47. Modeling Effect of Chemical-Mechanical Synergy on Material Removal at Molecular Scale in Chemical Me
48. A Model for the Low Cycle Fatigue Life Prediction of Discontinuously Reinforced MMCs
49. Bias Acceleration Model of Drain Resistance Degradation in InP-Based HEMTS
50. Plasma Damage Enhanced Transistor Reliability Degradation
51. Correction of Self-Heating for HCI Lifetime Prediction
52. A Contact Model for a Creeping Sphere and a Rigid Flat
53. Low-k SiCOH TDDB Phenomena and Its Reliability Lifetime Model
54. A Fracture Model of Corrosion Fatigue Crack Propagation of Aluminum Alloys Based on the Material Elements Fracture Ahead of a Crack Tip
55. Novel TDDB Mechanism for p-FET Accelerated by Hydrogen from HfSiON Film
56. A Comprehensive Model for Hot Carrier Degradation in LDMOS Transistors
57. A Simple Model for the Mode II Popcorn Effect in Thin Plastic IC Packages
58. Simple Model for Time-Dependent Dielectric Breakdown in Inter-and Intralevel Low-k Dielectrics
59. A Phenomenological Model for Erosion of Material in a Horizontal Slurry Pipeline Flow
60. A Prediction Model for Extremely Low Cycle Fatigue Strength of Structural Steel
61. A Study on the Effects of Machining-Induced Residual Stress on Rolling Contact Fatigue
62. An Engineering Model of Fatigue Crack Growth Under Variable Amplitude Loading
63. A New Model for Life Prediction of Fatigue-Creep Interaction
64. A Fatigue Damage Model of Composite Materials
65. A Universal Wear Law for Abrasion
66. Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates
67. Early Stage Hot Carrier Degradation of state-of-the-art LDD N-MOSFETs
68. The Reliability Study of MIM Capacitor Built On Top of Backside Via In III-V Compound MMIC
69. Reliability of SiGe HBTs for Power Amplifiers—Part II: Underlying Physics and Damage Modeling
70. Fatigue Life Prediction Under Variable Loading Based on a New Non-Linear Damage Mechanics Model
71. Corrosion Fatigue Behavior of Extruded Magnesium Alloy AZ31 in Sodium Chloride Solution
72. A Unified Expression for Low Cycle Fatigue and Extremely Low Cycle Fatigue (ELCF) and its Implicat
73. A Model for Moisture Induced Corrosion Failures in Microelectronic Packages
74. Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation - TDDB
75. Gate Dielectric Reliability in the Sub Threshold Regime
76. Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation - NBTI
77. Electromigration Failure Distributions of Cu/Low-k Dual-Damascene Vias
78. Electromigration Failure Distributions of Cu/Low-k Dual-Damascene Vias
79. Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation - HCI
80. Rolling Contact Fatigue Life of Finish Hard Machined Surfaces
81. Rolling Contact Fatigue Life of Finish Hard Machined Surfaces
82. Failure Mechanisms of GaN Metal–Semiconductor–Metal Photodetectors After Stressing
83. Visualization of Progressive Breakdown Evolution in Gate Dielectric
84. A Model for NBTI in Nitrided Oxide MOSFET Which Does Not Involve Hydrogen or Diffusion
85. Physical Charge Transport Models for Anomalous Leakage Current in Floating Gate-Based Memory Cells
86. Collapse of MOSFET Drain Current After Soft Breakdown
87. Statistical Modeling for Postcycling Data Retention of Split-Gate Flash Memories
88. Reliability Properties of Low-Voltage Ferroelectric Capacitors and Memory Arrays
89. Ultrathin Gate-Oxide Breakdown—Reversibility at Low Voltage
90. Re-consideration of Influence of Silicon Wafer Surface Orientation on Gate Oxide Reliability
91. Thin-Gate-Oxide Breakdown and CPU Failure-Rate Estimation
92. Scintillation Breakdowns and Reliability of Solid Tantalum Capacitors
93. Polarity-Dependent Device Degradation in SONOS Transistors Due to Gate Conduction
94. Charge Trapping Mechanism under Dynamic Stress and its Effect on Failure Time
95. Threshold Voltage Shift in 0.1 ?m Self-Aligned-Gate GaAs MESFETs Under Bias Stress
96. Chip Scale Package (CSP) Solder Joint Reliability and Modeling

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