This is just an Excerpt from a larger document, click here to view the entire document.Physics-of-Failure Prediction
The objective of any physics-of-failure analysis is to determine or predict when a specific end-of-life failure mechanism will occur for an individual component in a specific application. A physics-of-failure prediction looks at each individual failure mechanism such as electromigration, solder joint cracking, die bond adhesion, etc., to estimate the probability of component wearout within the useful life of the product. This analysis requires detailed knowledge of all material characteristics, geometries, and environmental conditions. Specific models for each failure mechanism are available from a variety of reference books (Reference 8).
The advantage of the physics-of-failure approach is that accurate predictions using known failure mechanisms can be performed to determine the wearout function. The disadvantage is that this method requires access to component manufacturer's material, process, and design data. In addition, the actual calculations and analysis are complicated activities requiring knowledge of materials, processes, and failure mechanisms.
